Welcome to Thermal Engineering Solutions!
| Thermal Engineering Solutions and its sister companies MJM Engineering Co and PCM Thermal Solutions. are R&D and consulting firms specialized in the cooling of electronics and telecommunication components and systems and thermal engineering consulting and R&D design and development services on all areas of thermal engineering. If your project involves fluids, heat or mass transfer and their interactions with any engineering system, we are here to help. Further, We can also provide Biomedical and Bioengineering Research and Development Services. We are a small company, and we can guarantee you personalized service, attention to detail, and the shortest turnaround time, world-wide. MJM Engineering Co has been in business since 1994 and has had a variety of projects and clients. We can help you with selection of CFD software packages and thermal dissipation equipment such as heat sinks, microchannels, heat pipes, cooling assemblies, compact heat exchangers etc. Furthermore, we also hold one- and two-day short courses on thermal management of electronics/telecom systems. Our team of thermal experts have a combined 25 years’ technical experience in backgrounds and capabilities outlined below. Areas of expertise include heat exchanger design, thermal system design and optimization, fluid mechanics and convection heat transfer, and cooling of electronic systems, including phase change materials. Some Technical Papers Written by MJM Engineering’s Personnel: Cosley, M.R., and Marongiu, M.J., “Analytical and Computational Thermal Analysis of Underground Battery Vaults,” FLOTHERM 2nd Users Conference, Boston, MA, May 11,12, 1993 Cosley, M.R. and Marongiu, M.J., “Parametric Thermal Analysis of Telecommunications Underground Battery Vaults: Rectangular Configurations,” presented at ASME Winter Annual Meeting, New Orleans, LA, Nov. 30-Dec.. 2, 1993. Marongiu, M.J. and Cosley, M.R., “Parametric Thermal Analysis of Telecommunications Underground Battery Vaults: Cylindrical Configurations,” presented at ASME Winter Annual Meeting, New Orleans, LA, Nov. 30-Dec 2, 1993 Cosley, M.R. and Marongiu, M.J. “Studies on the Use of Radial Jet Reattachment Nozzles as Active Heat Sinks for Electronic Component Boards,” presented at SEMI-THERM Symposium, San Jose, CA, Feb. 1-3, 1994 Marongiu, M.J., and Cosley, M.R., “Analytical/computational Studies of the Ground Thermal Characteristics for Underground Battery Vault Applications,” presented at Fourth Inter society Conference on Thermal Phenomena in Electronic Systems (I-THERM) Washington, DC USA, May 4-6, 1994. Marongiu, M.J. and Cosley, M.R., “Interference Effects Between Two Radial Nozzles for Surface Heat Transfer Applications,” presented at 6th AIAA/ASME Thermophysics and Heat Transfer Conference Colorado Springs, CO, June 20-23, 1994 Marongiu, M.J., Stromblad, B. and Cosley, M.R., “Experimental Studies Using Confined Radial Nozzles,” presented at Forum on Industrial and Environmental Applications of Fluid Mechanics, 1994 ASME Fluids Engineering Division, Lake Tahoe, Nevada, June 19-23, 1994 Marongiu, M.J., Sumner, B., and Kozak, E., “Experimental Studies On Enhanced Impingement Cooling Using Nozzles With Tabs As Active Heat Sinks For Electronic Component Boards,” presented at ASME Winter Annual Meeting, Chicago, IL, November 6-11, 1994 Cosley, M.R., Garcia, M.P., L. K. Grzesik, J. Webster, and Marongiu, M.J., “Thermal Development Of Modular Outdoor Cabinets,” presented at INTELEC ‘95, The Hague, Holland, Oct 29-Nov. 1, 1995 Marongiu, M.J., “Some Issues In Experimental Testing And Methodologies In The Thermal Management Of Telecommunication Components, Systems And Enclosures,” presented at INTELEC ‘95, The Hague, Holland, Oct 29-Nov. 1, 1995 Marongiu, M.J., Cosley, M.R., and Garcia, M.P., “Experimental And Computational Studies On The Thermal Management Of Electronics Enclosures Using Natural Convection,” presented at EUROTHERM ‘95 seminar, Leuven, Belgium, Sep. 19-22, 1995 Marongiu, M.J., “Some Advances In Impingement Cooling For Heat Sinks In Electronic Systems And Components,” presented at EUROTHERM ‘95 seminar, Leuven, Belgium, Sep. 19-22, 1995Marongiu, M.J., “Radial Nozzles: What are They,” Electronics Cooling Magazine, May 1995 Marongiu, M.J., “Issues In The Thermal Management Of Outdoor Telecommunications Cabinets/Enclosures,” published in Communications Systems Design Magazine, October 1995. Marongiu, M.J., “Issues In The Thermal Management Of Outdoor Telecommunications Cabinets/Enclosures,” published in Communications Systems Design Magazine, Jan 1996. Marongiu, M.J., ” Compressibility Effects In The Design Of Gas-Cooled Microchannel Heat Sinks”, presented at I-THERM 96, Orlando, FL, May-June 96. Marongiu, M.J., ” Enhanced Impingement Cooling Using Nozzles With Modified Exit Geometries For Active Heat Sinks,” presented at IECEC 96, Washington DC, Aug. 11-17, 1996 Marongiu, M.J., ” Simulation Of Large Outdoor Enclosures Using Model Laws And Similitude, INTELEC ’96, Boston, MA, Oct 7-10, 1996 Marongiu, M.J., “Thermal Management Design Of Battery Compartments Of Outdoor Telecommunication Cabinets, ” INTELEC ’96, Boston, MA, Oct 7-10, 1996. Marongiu, M.J. ” Closed-Loop Cooling Systems For Telecom Applications: Their Basics And Implementation,” published in Communications Systems Design Magazine, Jan 97. Marongiu, M.J., and Clarksean, R., ” Numerical Simulation Of Large Outdoor Enclosures Using Model Laws And Similitude,” presented at Sixth Australasian Heat & Mass Transfer Conference, Sydney, Australia, Dec 9-12, 1996 Marongiu, M.J., “Thermal Management Issues In The Design Of Outdoor Telecommunications Systems,” TELESCON 97 proceedings, Budapest, Hungary, April 21-25, 1997 Marongiu, M.J., ” Design Of Compact Heat Exchangers For The Thermal Management Of Battery Compartments Of Outdoor Telecommunication Cabinets,” TELESCON 97 proceedings, Budapest, Hungary, April 21-25, 1997 Marongiu, M.J., Kusha, B., and Watwe, A., ” Computational Studies On Enhanced Thermal Management Of Outdoor Enclosures Using Natural Convection In Open Channel On External Walls” to be presented at InterPAK 97, Honolulu, HI, June 15-17, 1997 Marongiu, M.J., “CFD Tools for Engineers,” Desktop Engineering Magazine, February 1997. Marongiu, Max. J, Marongiu, Maurice J., and Laughner, V., “PC Workstations”, Desktop Engineering Magazine, May 1997.Marongiu, M.J., and Clarksean, R., “Thermal Management Of Electronics Enclosures Under Unsteady Heating/Cooling Conditions Using Phase Change Materials (PCM),” to be presented at ASME National Heat Transfer Conference, Baltimore, MD, Aug 2-7, 1997.Marongiu, M.J., and Clarksean, R., “Thermal Management Of Electronics Enclosures Under Unsteady Heating/Cooling Conditions Using Phase Change Materials (PCM),” to be presented at 32nd Intersociety Energy Conversion Engineering Conference, Honolulu, HI, July 27-Aug.1, 1997. Marongiu, M.J., Kusha, B., and Watwe, A., ” Computational Studies On Enhanced Thermal Management Of Outdoor Enclosures Using Natural Convection In Open Channel On External Walls” to be presented at 32nd Intersociety Energy Conversion Engineering Conference, Honolulu, HI, July 27-Aug.1, 1997. Marongiu, M.J., Kusha, B., and Watwe, A., “Heat Sink Numerical Simulation with Icepak using Compact Heat Sink Modeling Techniques,” to be presented at IMAPS 30th International Symposium on Microelectronics,” Philadelphia, PA, Oct. 12-16, 1997 Marongiu, M.J. and Clarksean, R., “Thermal Management of Battery Compartments of Outdoor Telecommunications Cabinets using Phase Change Materials,” to be presented at INTELEC 97, Sydney, Australia, October 1997 Marongiu, M.J., Kusha, B., and Watwe, A., “Studies On The Enhancement Of Microchannel Heat Sinks With Micro-Heat Pipes” to be presented IMAPS 1997 International Systems Packaging Symposium, San Diego, CA, Dec 2-5, 1997 |